UVPROM Memory ICs Parts Catalog

Manufacturer's List :

BB Electronics	NXP Semiconductors	Intersil Corporation	LSI Corporation	ST microelectronics
Advanced Micro Devices	Thales Group	White Electronic Designs	E2v technologies	Atmel Corporation
Microchip Technology	Rochester Electronics	Cypress Memory	Toshiba Memory	Micross Components
Vishay Siliconix	Renesas Electronics America	Texas Instruments

Part Numbers based on Part Type 'uvprom memory ics'

Part No	Manufacturers	Description	Quantity	RFQ

27C256MEQ7B/Y25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CQIC 32K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024DESC06XA	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C256MQB/C25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CDIC 32K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024MEQ1B/C20	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MQ15	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
AT27C256R-45JUSL383	Atmel Corporation	OTP EPROM, 256K (32K X 8), 5VOTP EPROM, 256K (32K X 8), 5V, RAPID PROG - 45NS, PLCC, IND	Available	RFQ
27C64MQ7B/Y25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CDIIC 8K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024MEQ25	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
AT27C256R-DWF	Atmel Corporation	DIE, WAFER FORM(EPROM) DIE, WAFER FORM(EPROM)	Available	RFQ
27C1001MEQ20	E2v technologies	IC 128K X 8 UVPROM, 200 ns, CIC 128K X 8 UVPROM, 200 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1001MQ7B/Y15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1001MEQ1B/C20	E2v technologies	IC 128K X 8 UVPROM, 200 ns, CIC 128K X 8 UVPROM, 200 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
AT27C512R-DWF	Atmel Corporation	AT27C512 DIE WAFER FORM(EPROMAT27C512 DIE WAFER FORM(EPROM)	Available	RFQ
27C256MQG/B25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CDIC 32K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C256MQ7B/Y15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CDIC 32K X 8 UVPROM, 150 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024MEQ12	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1001MQ15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/T12	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MQ20	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MQB/C15	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C256MEQ1B/C25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CQIC 32K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MQB/C90	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CDIC 64K X 16 UVPROM, 90 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MEQ1B/T10	E2v technologies	IC 64K X 16 UVPROM, 100 ns, CIC 64K X 16 UVPROM, 100 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1001MEQ7B/Y15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C64MQ30	E2v technologies	IC 8K X 8 UVPROM, 300 ns, CDIIC 8K X 8 UVPROM, 300 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024DESC07QA	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CDIC 64K X 16 UVPROM, 90 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C64MQ25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CDIIC 8K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C256MEQ7B/Y20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CQIC 32K X 8 UVPROM, 200 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/C15	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C256MEQ25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CQIC 32K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C64MEQ1B/B25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CQCIC 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024DESC05XA	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MEQ20	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MQB/T20	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C256MQ15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CDIC 32K X 8 UVPROM, 150 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C64MEQ1B/C25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CQCIC 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1001MQG/B15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/C10	E2v technologies	IC 64K X 16 UVPROM, 100 ns, CIC 64K X 16 UVPROM, 100 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C64MQB/B25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CDIIC 8K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C256MEQ1B/C20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CQIC 32K X 8 UVPROM, 200 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/T20	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C256MQ7B/Y25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CDIC 32K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C64MEQ25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CQCIC 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C256MEQ20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CQIC 32K X 8 UVPROM, 200 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MEQ15	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MQB/C10	E2v technologies	IC 64K X 16 UVPROM, 100 ns, CIC 64K X 16 UVPROM, 100 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C64MQG/B30	E2v technologies	IC 8K X 8 UVPROM, 300 ns, CDIIC 8K X 8 UVPROM, 300 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024DESC07XA	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CQIC 64K X 16 UVPROM, 90 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
AT27C256R-W	Atmel Corporation	DIE(EPROM) DIE(EPROM)	Available	RFQ
27C256MEQG/B20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CQIC 32K X 8 UVPROM, 200 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MQ12	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MEQ90	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CQIC 64K X 16 UVPROM, 90 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
AT27C516-45JU	Atmel Corporation	45NS, PLCC, IND TEMP, GREEN(E45NS, PLCC, IND TEMP, GREEN(EPROM)	Available	RFQ
27C1001MEQ25	E2v technologies	IC 128K X 8 UVPROM, 250 ns, CIC 128K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1001MQB/C20	E2v technologies	IC 128K X 8 UVPROM, 200 ns, CIC 128K X 8 UVPROM, 200 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1024DESC06QA	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
AT27C040-DWF	Atmel Corporation	DIE, WAFER FORM(EPROM) DIE, WAFER FORM(EPROM)	Available	RFQ
27C256MEQG/B15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CQIC 32K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024DESC03XA	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C64MQG/B25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CDIIC 8K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C256MQ20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CDIC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024MQB/C25	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C256MQ25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CDIC 32K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024MEQ10	E2v technologies	IC 64K X 16 UVPROM, 100 ns, CIC 64K X 16 UVPROM, 100 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1001MQ7B/Y20	E2v technologies	IC 128K X 8 UVPROM, 200 ns, CIC 128K X 8 UVPROM, 200 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1024DESC02QA	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MEQ1B/C90	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CQIC 64K X 16 UVPROM, 90 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C256MQB/C20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CDIC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
AT27C512R-70RZ	Atmel Corporation	70NS, SOIC, AUTOMOTIVE TEMP, 70NS, SOIC, AUTOMOTIVE TEMP, GREEN PKG(EPROM)	Available	RFQ
27C1024DESC05QA	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
AT27C020-DWF	Atmel Corporation	1M DIE IN WAFER FORM(EPROM) 1M DIE IN WAFER FORM(EPROM)	Available	RFQ
ET2716-Q1	E2v technologies	IC 2K X 8 UVPROM, 350 ns, CDIIC 2K X 8 UVPROM, 350 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM	Available	RFQ
27C64MQB/C25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CDIIC 8K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C1024MQB/C12	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
AT27C010-DWF	Atmel Corporation	1M DIE IN WAFER FORM(EPROM) 1M DIE IN WAFER FORM(EPROM)	Available	RFQ
27C1024MEQ1B/T90	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CQIC 64K X 16 UVPROM, 90 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MQB/T12	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C256MQG/B20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CDIC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C64MEQ7B/Y25	E2v technologies	IC 8K X 8 UVPROM, 250 ns, CQCIC 8K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C256MQB/C15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CDIC 32K X 8 UVPROM, 150 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C256MEQ1B/C15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CQIC 32K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/T25	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C256MEQ7B/Y15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CQIC 32K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MQB/T15	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MQ90	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CDIC 64K X 16 UVPROM, 90 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MEQ1B/C25	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C1024MQB/T25	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MQB/T90	E2v technologies	IC 64K X 16 UVPROM, 90 ns, CDIC 64K X 16 UVPROM, 90 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1024MQB/C20	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1001MQ25	E2v technologies	IC 128K X 8 UVPROM, 250 ns, CIC 128K X 8 UVPROM, 250 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1024MQB/T10	E2v technologies	IC 64K X 16 UVPROM, 100 ns, CIC 64K X 16 UVPROM, 100 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C256MQ7B/Y20	E2v technologies	IC 32K X 8 UVPROM, 200 ns, CDIC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
27C256MEQ15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CQIC 32K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MQ10	E2v technologies	IC 64K X 16 UVPROM, 100 ns, CIC 64K X 16 UVPROM, 100 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C1001MEQ1B/C15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1001MEQ15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/C12	E2v technologies	IC 64K X 16 UVPROM, 120 ns, CIC 64K X 16 UVPROM, 120 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ
27C256MQG/B15	E2v technologies	IC 32K X 8 UVPROM, 150 ns, CDIC 32K X 8 UVPROM, 150 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM	Available	RFQ
ET2716Q	E2v technologies	IC 2K X 8 UVPROM, 450 ns, CDIIC 2K X 8 UVPROM, 450 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM	Available	RFQ
27C1001MQB/C15	E2v technologies	IC 128K X 8 UVPROM, 150 ns, CIC 128K X 8 UVPROM, 150 ns, CDIP32, CERAMIC, DIP-32, Programmable ROM	Available	RFQ
27C1024DESC03QA	E2v technologies	IC 64K X 16 UVPROM, 200 ns, CIC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERDIP-40, Programmable ROM	Available	RFQ
27C256MEQG/B25	E2v technologies	IC 32K X 8 UVPROM, 250 ns, CQIC 32K X 8 UVPROM, 250 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM	Available	RFQ
27C1024MEQ1B/T15	E2v technologies	IC 64K X 16 UVPROM, 150 ns, CIC 64K X 16 UVPROM, 150 ns, CQCC44, CERAMIC, LCC-44, Programmable ROM	Available	RFQ

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